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4 Tips for Selecting a Nickel+Chromium Sputtering Target.
Sputtering is a process that involves the removal of atoms from a surface by bombarding it with positively charged ions. This process is used extensively in the semiconductor industry to create thin films of various materials onto silicon wafers. One of the most commonly used materials for sputtering is the Nickel+Chromium (NiCr) alloy. However, selecting the right NiCr sputtering target can be a daunting task. Here are four tips for selecting a NiCr sputtering target.
1. High Purity.
The purity of the NiCr sputtering target is critical in ensuring the quality and uniformity of the thin film. Impurities in the target material can affect the composition and properties of the deposited thin film. Ideally, the purity of the NiCr target should be above 99.99%.
2. Homogeneity.
The homogeneity of the NiCr target refers to the uniformity of its composition and microstructure throughout its bulk. The target should have a consistent composition and microstructure to ensure a uniform deposition rate across the entire substrate surface. Inhomogeneity can lead to a non-uniform film thickness and poor film quality.
3. Target Geometry.
The geometry of the NiCr target is crucial in determining the efficiency and target utilization during the sputtering process. The target shape and size should be optimized for the specific sputtering system and application. A well-designed target can lead to higher sputtering rates and longer target lifetimes.
4. Cost-effectiveness.
Finally, the cost-effectiveness of the NiCr sputtering target should be considered. The cost of the target can vary significantly depending on its purity, homogeneity, and geometry. A balance should be struck between the target's quality and performance requirements and its cost.
In conclusion, selecting the right NiCr sputtering target is crucial in ensuring the quality and efficiency of the sputtering process. High purity, homogeneity, optimized target geometry, and cost-effectiveness are essential factors to consider when choosing a NiCr sputtering target. Proper target selection can help to achieve a high-quality and uniform thin film deposition, which is critical in many applications, including semiconductor devices, solar cells, and flat-panel displays.
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